Product Description:

♦ It adpot the CNC finishing, precision up to 0.01mm, flatness 0.05 mm

♦ The overall structure has strong stability, high strength, wear resistance, durable and not easy to damage, repeated use.

♦ Assembly molding, can hold the handle, rotating stop rod

Features:

Advantage:

♦ Reduce waste: by processing wafers before packaging. Testing, picking out bad dies, reduces packaging and finished chip testing costs.

♦ Comprehensive testing: The finished product after packaging can be tested. Comprehensive testing of circuit performance, selection of qualified finished products, and classification based on parameter indicators of device performance.

♦ Data feedback: The detailed data generated by the test results can fully and quantitatively reflect various indicators of each chip from structure, function to electrical characteristics.

Application:

• Microelectronics technology:
Provide a secure storage and transportation environment in the production of microelectronic devices.

• Research laboratory:
Used in the research and development process to assist researchers in managing and organizing wafer samples.

Packing and Shipping:

Adopt moisture-proof, shock-proof and pressure-proof packing method.

• Choose sturdy cartons, wooden boxes or iron drums and other packaging containers.
• Fill the interior with cushioning materials such as foam, bubble bags,Label the outer package with product information, delivery address, etc.

​Choose a regular international logistics company.

• According to the mode of transportation (sea, air, etc.) to do a good job of storage, loading and unloading
• Maintain temperature and humidity control throughout the transportation of goods. Properly handle the return and exchange of goods due to transportation damage.

Hiner-pack has leading mold processing and injection molding equipment, high-grade dust-free cleaning line and a variety of testing equipment.Meanwhile,Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions.

Hiner-pack has mastered special processing technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to launch,and to solve the customer demand for high quality products.

Learn more about our company through our official website https://www.hiner-pack.com/english/

Learn more JEDEC TRAY IC TRAY information through our official website https://www.jedecictrays.com/