• Wafer hoop ring is commonly used in the wafer COB packaging process. The first step is to expand the wafer. To realize this, an expanding machine is used to uniformly expand the wafer films that comes from the manufacture. This facilitates the forthcoming procedures.
• It consists of two robust inner and outer rings that help to hold the wafer firmly in place while it is expanded. This process splits apart the wafer particles that were closely attached to the surface of the film, making it then easier to extract.

Features:

• Thermal expansion control: The expansion ring is designed to effectively control the thermal expansion of the wafer during temperature changes, reducing deformation caused by temperature changes.

• Lightweight: The design considers reducing weight for ease of operation and installation, while not affecting its strength and performance.

• Multiple specifications: We offer a variety of sizes and models to meet the needs of wafers with different diameters and thicknesses.

Application:

• Testing phase: In the wafer testing and inspection process, the expansion ring helps to maintain the flatness and stability of the wafer, ensuring the accuracy of test data.
• Device adaptation: In different types of semiconductor manufacturing equipment, expansion rings can be used to adapt wafers of different sizes and thicknesses, improving the versatility of the equipment.
• Wafer processing: During wafer cutting, grinding, and polishing processes, the expansion ring is used to ensure the stability of the wafer and prevent deformation caused by temperature changes.

Packing and Shipping:

• The Wafer Hoop Ring is securely packaged in a box with bubble wrap and foam to ensure it reaches you in perfect condition. The box is then securely sealed and labeled with the product name and address.
• The Wafer Hoop Ring is shipped via UPS, FedEx, or USPS. Tracking information will be provided once the product is shipped.

Hiner-pack has leading mold processing and injection molding equipment, high-grade dust-free cleaning line and a variety of testing equipment.Meanwhile,Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as scientific research institutions.

Hiner-pack has mastered special processing technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products, new products continue to launch,and to solve the customer demand for high quality products.

Learn more about our company through our official website https://www.hiner-pack.com/english/

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